It all depends on your modules, the chip density on the modules, and the frequency the RAM is running at. The higher the density of the chips on the module, the longer the refresh has to be, and therefore the higher tRFC has to be. Density means for example, a 16 GB module using 8 chips has double the density of an 8GB module using 8 chips. Then there are known values to which certain types of chips can go down to, again, depending on the chip in combination with the frequency it's running at. If you run at DDR4-4266, your tRFC has to be higher than at DDR4-3600, to arrive at the same amount of time in nanoseconds.
However, tREFI (the interval between refreshes) is always officially deemed to stay the same 7.8 μs (microseconds, from mikros = small in Greek). There is no such dependency on density etc., but instead they said, this is a proper value for DDR4 RAM that will ensure that there's never a problem, no matter the module. This, of course, is thrown overboard with RAM OC. You see most OC guides recommend to max it out at 65K. But most overclockers who write these guides only tend to test for stability. As i said, data retention is much harder to test, the bit fade test in Memtest86 attempts to do it, but i don't see much RAM failing on that part of testing. Maybe it has to be tested in a worst-case scenario like i mentioned before, because as the modules get hot, the official specs call for double the refresh cycles (every 3.9 μs).
I try to stay more on the safe side and go to tREFI 32K with my Samsung B-Die. There is really no scale for it. If you want to be safer, stay at 32K, if you want to challenge something that's hard to test, go to 65K at your own risk...
Note that in the above table, tRFC is in nanoseconds. That is not the value you enter in the BIOS, that one is in clock cycles. To calculate the tRFC value, there is this table:
350 ns at DDR4-3600 means a tRFC value of 630 clock cycles. Depending on the chips/ICs used on the module, you can go a bit lower, a bit more lower, or way lower in the case of Samsung B-Die. B-Die should be good for 160-180 ns. This is one of the main strengths of it. For your DDR4-4266, if it were B-Die, you would be able to set tRFC as low as 340-380 clock cycles. But with other chips, this is not possible at all. With Hynix CJR, you're looking more at 280 ns as the lowest time, which means, you could try tRFC 600 at your frequency, looking at the above table.