I have done extensive testing on Bdie, Ddie 2R. and Hynix Mdie (MFR) on the X370 gaming plus.
No issues with the Bbie kit running at 3200cl14, no issues with the Ddie **dual rank** at 3200cl16, couldn't run hynix kit at more than 3066.
So my IMC is perfectly capable of running tight 3200 and dual rank 3200. So no, it's not the IMC the issue with the Hynix kits,let's dispel that notion and save the people time and money with RMA'ing perfectly fine (unless you're concerned with segfault errors) CPUs.
Here is my 3200 hynix kit and here are the settings for 3066 reasonably tight:
https://i.imgur.com/SJEUaRa.jpgHere's my 3200 2R Samsung Ddie kit and here are the settings for 3200 (can be tighter)https://i.imgur.com/UhMcXUs.png1T, geardown enabled, 1.37V, 1.1V Soc, 60 Ohm procODT (update your bios first)
With bdie you won't encounter any problems.
So, anyone encountering an issue just use the aforementioned timings/settings.
Kits tested:
F4-3200C16-16GVKB (Hynix)
F4-3200C14-16GVK (Samsung Bdie)
F4-3400C16-16GVK (Samsung Ddie)
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PS: The hynix kit runs flawlessly on a 8700K at its rated speed, so it's not overly optimistic with its rating.
PPS: The 2R cl16 performs better than 1R cl14 at 3200MHz. But at stock timings, didn't have much time with the bdie kit since it was a loaner.